MX5-2 Series

·Patented thick-channel design. The application of high-power triodes and FETs enhances single-tube power, improves uniform heat
dissipation of chips, and boosts thermal stability of the product .
·Nanosecond-level power energy supply switching, increasing energy utilization efficiency by 30% significantly to achieve energy saving .
·P-level distortion circuit design, laying a solid foundation for high-fidelity sound quality.
·Finned heat dissipation structure made of high-conductivity and high-diffusion aviation aluminum alloy, improving heat dissipation
efficiency of power devices .
·Large-cave ventilation design with exhaust hole boss structure ensures smooth air path and timely heat exhaust, keeping power
components in a favorable temperature environment during high-power operation and extending their service life .